ZM-R6200 Replace chip machine
Usage: Desolder and solder all the BGA Chip.Rework BGA Machine, Desolder BGA Machine, Solder BGA machine, remove and repair computer, xbox360 and mobile motherboard BGA Chip. such as GPU, CPU, Graphic card, south bridge, north bridge etc. even for lead free BGA Chip.
Product description Feature:
1, semi automatical desolder, solder,weld BGA Chip of laptop, computer, xbox360 and motherboard. even for lead free BGA Chip.
2, Top and bottom hot air heaters and 3rd infrared heater.
3, top heater is stepped drive control.
4,Touch screen and joystick control, easy operation.
5, Stable and precise temperature, ensure good welding effect.
6, High optical alignment vision system could clearly and precisely make BGA Chip match with motherboard.
7, USB.
8,Warranty: 1 year.
2,Specification parameters:
| 1 |
Total power |
4800W Max |
| 2 |
Top heater power |
800W (1st heater) |
| 3 |
Bottom heater power |
1200W (2nd heater) |
| 4 |
3rd IR heater |
2700W (independent controlling left and right IR heaters) |
| 5 |
power |
AC 220V±10 50/60Hz |
| 6 |
Electrical materials |
temperature control system Adopted Dalian University of Technology |
| 7 |
Dimensions |
L640*W630*H900mm |
| 8 |
Temperature control |
K-type thermocouple (Closed Loop), intelligent temperature compensation system |
| 9 |
Positioning |
V type groove,with universal fixture |
| 9 |
P C B size |
Max 410×370mm, Min65×65mm |
| 10 |
Available BGA chip |
1×1~ 80×80mm |
| 11 |
External temperature sensor |
1piece |
| 12 |
Net weight |
65kg |
| 13 |
Package |
Wooden box |
| 14 |
G.W. |
120KG |
| 15 |
Dimension |
L75cm*W75cm*H90cm |
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