BGA Rework Station ZM-R5860C

BGA Rework Station ZM-R5860C

Weldering BGA chip Machine/BGA Rework Station ZM-R5860C laptop’s motherboard and gamer motherboard

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  • Reviews (0)


Quick Details

  • Type: Other
  • Place of Origin: Guangdong, China (Mainland)
  • Brand Name: Seamark/Zhuomao
  • Model Number: ZM-R5860C
  • Voltage: 220V
  • Current: 15A
  • Rated Capacity: 4800W
  • Rated Duty Cycle: 95%
  • Dimensions: 635*600*560mm
  • Weight: 40KG
  • Usage: Desoldering and soldering BGA chip
  • Certification: CE ISO
  • After-sales Service Provided: Engineers available to service machinery overseas
  • Colour: black
  • model: zm-r5860c
  • brand: seamark
  • warranty: 1 year warranty and life-long maintanance
  • voltage: 220v
  • usage: repair all kinds of bga chips

Packaging & Delivery

Packaging Details: Wooden Box
Delivery Detail: 1-2days

Specifications and technical parameters Of ZM-R5860C:

Total Power
Top heater
Bottom heater
2nd heater 1200W,3rd IR heater 2700W
Power supply
AC220V±10%     50/60Hz
V-groove, PCB support can be adjusted in any direction with external universal fixture
Temperature control
(K Sensor) closed loop, independent heating, precision within ±3°
PCB size
Max 410×370mm Min 20×20 mm
Electrical selection
Highly sensitive temperature control module+Touch screen (Taiwan)+Delta PLC







ZM-R5860C Main Feature:

1. Adopt liner slide which makes X,Y,Z axis all can do precision adjustment or fast positioning, with high positioning accuracy and fast maneuverability
2. High definition touch screen (Taiwan) , PCL control, can save multiple groups profile, password protection and modify function, and can save multiple groups profile, equipped with instant temperature curve analysis function
3. There are 3 independent heating areas from top to bottom. The 1st and 2nd are hot-air heaters, the 3rd is IR preheating, temperature controlled within ±3 °, Top heater can be adjusted freely, second heater can be adjusted up and down, top and bottom temperature can control many groups and sections of temperature parameters at the same time; the third IR heater can be adjusted the power consumption

4. Offer all kinds of hot-air nozzle, it can rotate 360° With magnet, easy to install and change, customized is available  Bottom IR heater ensure an even heat for PCB board
5. Choose imported high-precision K-type thermocouple, closed loop control and automatic temperature compensation system, combined PLC module for the precision control of temperature.
6. Use a V-groove equipped with a flexible fixture for PCB positioning to protect the PCB from deformation when heated or cooled, and it can rework for any BGA package size;
7. powerful cross-flow fan rapidly cool the PCB board to improve efficiency, Also built-in vacuum pump and external vacuum suction pen, pick up the chips rapidly .
8. After finishing desoldering and soldering, There is an alarming and alarming in advance
9. CE certificate, there is  emergency stop and Automatic power-off protection device ,also  a double over-heating protection control.

10. HD camera system ,accurate judgments on the melting process during the BGA soldering and desoldering ,provide critical vision.


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